We are maintaining our unrivaled competitive edge with our invisible core imaging solution technology for next-generation IT devices that will create the smart lifestyle of the future.
SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA. TILT OIS CAMERA
SCROLL DOWN
CAMERA MODULE FOR MOBILE
SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA. TILT OIS CAMERA
CAMERA MODULEHigh-quality core technology demanding high definition as well as miniaturization and slimming in all fields of application is a necessity. We possess the necessary core technology for mobile solutions with scientific and electrical/electronic device design technology.
Stable mass production yield for various camera modules (5M FF – 108M AF)
WIDE ANGLE VT CAMERA 90°,120°,135°,145°,182°8M FF ~ 32M FF
MACRO CAMERA 5M FFSINGLE CAM 13~64M AFDUAL CAMERA
TRIPLE CAMERA
QUAD CAMERA
OIS CAMERA
PDAF CAMERA
TILT OIS CAMERA
Smaller sensor pixel size(3.3→2.8→2.2→0.9→0.8㎛)
SMART PHONE CAMERA MODULE
SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA
UP TO X10 OPTICAL ZOOM-IN LOWER HEIGHT USING PRISM MECHANISM ENHANCED IMAGE DISTORTION AS MATCHING PIVOT CENTER AND OPTIC CENTER
AF SPEC
ITEMS
UNIT
SPEC
Rated Stroke
um
Min 2410
Hysteresis
um
Max 12
Linearity
um
Max 20
Holding Current
mA
Max 40
Actuating Tilt
Min
Max 10
OIS SPEC
ITEMS
UNIT
SPEC
Rated Stroke
Deg
Min 2.4 (±1.2)
Hysteresis
Deg
Max 0.10
Linearity
Deg
Max 0.11
Max current
mA
Max 100
Phase margin
Deg
Max 25
Loop Gain
dB
Min 20
TOF CAMERA MODULE
PROVED THAT THE OPTICAL FOWLP CAN BE USED FOR TOF SENSOR APPLICATION 20% SMALLER, AND 230UM THINNER MODULE IS POSSIBLE.
SPECIFICATION
ITEMS
MIN
NORMAL
MAX
UNIT
REMARK
PKG Height
222
270
318
UM
Ball Pitch X
-
500
-
UM
Ball Pitch Y
-
500
-
UM
Total Ball Count
-
314
-
EA
Resolution
-
320 X 240
-
PX
QVGA
Modulation frequency of VCSEL Driver
20
-
100
MHZ
VCSEL wavelength
-
940
-
NM
KEY FEATURES
Size
Removal of PCB, substrate-less
3D stacking of TOF sensor and the driver IC
Thickness reduction (>230um) / Area reduction (>20%)
Easy mounting
No Ceramic Carrier or substrate PCB needed
UseACF film or SMT process to electrically assemble the FOWLP onto the F-PCB
Mass-production
The optical FOWLP is fabricated by the wafer level process with mass-production capability
TILT OIS
A TILT OIS MODULE MINIMIZES SHAKING IN EXTREME CONDITIONS OR FOR SCENES WHERE ORDINARY SHOOTING IS NOT POSSIBLE, THEREBY PROVIDING YOU WITH THE HIGHEST-QUALITY SCENES
OUTSIDE VIEW AND FEATURE
Exterior Darwing and Characteristics
Using MODULE TITL form, no more resolution deterioration problem as in pre-existing LENS SHIFT/TITL form
Existing commercialized product : Supports hand shaking correction
MODULE TILT OIS : Supports hand shaking correction + external shaking(shooting while moving on uneven topography, etc.) correction
SPECIFICATION
ITEMS
CONDITION
Foot Print
A : 18.4 x 18.4 x 1.8H / B : 14.0 x 14.0 x 4.7H
Stabilizing Angle
± 3deg
Max Current
AF : 50mA / OIS : 100mA (TBD)
Pixels
48M
SENSOR
SONY 1/2" 48Mega CMOS IMS586-AAJH5-S
Sensor Size
4.504mm(H) x 5.659mm(V)
LENS
SUNNY 39256
LENS Spec
8.25/6P
AF STROKE
380 ~ 430um
RC MODEL CAR
TILT. OIS OFF
TILT. OIS ON
TILT OIS. VIDEO
USB CAMERA MODULE
5MP USB CAMERA BOARD
ITEM
USB Camera SPEC
Form factor
PCB Module Type
PCB SIZE
50mm x 7mm x 0.8T
Camera Resolution(MAX)
5MP(2592x1944)
Image Sensor
1/5, Pixel size:1.12um
Video Max frame rate
30fps@5Mp(2592 x 1944)/30fps@quad HD(2560 x 1440)
MIC
2MIC Support
I/O Interface
USB 2.0
Camera Interface(AP-Camera)
MIPI(CSI-2/4 lane)
Lens spec
4P, F2.4
8MP USB CAMERA BOARD
ITEM
USB Camera SPEC
Form factor
PCB Module Type
PCB SIZE
40mm x 12mm x 1.0T
Camera Resolution(MAX)
8MP(3264x2448)
Image Sensor
1/4, 200um, Pixel size:1.12um
Video Max frame rate
MJPEG: 8MP 10fps@(3264 x 2448), 4:3
5MP 10fps @(2592 x 1944)
2MP 60fps @(1600 x 1200) / YUY2:5fps@(1600x1200)
MIC
Option
I/O Interface
USB 2.0
Camera Interface(AP-Camera)
MIPI(CSI-2/4 lane)
Lens spec
4P, F2.2
3D DEPTH CAMERA
3D DEPTH CAMERA
2 cameras can be driven with 1 controller; image compositing through controller possible, 3D materialization possible without separate software, so user can choose 2D or 3D
SIDE BY SIDE (SHUTTER GLASS) Screen
Displayed with left/right crossing for every frame, left/right liquid crystal shutters open/close in a crossing manner matching with the frame timing
MCNEX who leads change of future will take a big step to the world with continuous innovative technology.
The invisible core technology of MCNEX is unseen but to turn everyone's imagination into reality,
is always closed to our life every time and everywhere.
MULTIMEDIA CORE OF THE NEXT... MCNEX
SUBSCRIBE TO MCNEX. NEWSLETTER
We will send you news and information about MCNEX on a regular basis via email.
TRIPLE CAMERA
QUAD CAMERA
OIS CAMERA
PDAF CAMERA
TILT OIS CAMERA
F.NO_2.0 / FOV_68°
F.NO_2.4 / FOV_78°
F.NO_2.4 / FOV_85°
F.NO_2.2 / FOV_123°
F.NO_2.2 / FOV_80°
F.NO_2.2 / FOV_120°
F.NO_2.2 / FOV_123°
F.NO_2.0 / FOV_78°
F.NO_1.9 / FOV_76°
F.NO_2.0 / FOV_79°
F.NO_1.9 / FOV_76°
F.NO_2.2 / FOV_85°
F.NO_2.2 / FOV_80°
F.NO_2.4 / FOV_80°
F.NO_1.7 / FOV_75°
F.NO_2.0 / FOV_76°
F.NO_1.9 / FOV_77°
F.NO_2.2 / FOV_80°
F.NO_1.8 / FOV_80°
F.NO_2.0 / FOV_80°
F.NO_1.8 / FOV_81°
.
F.NO_2.4 / FOV_32°
F.NO_2.4 / FOV35°
F.NO_2.4 / FOV_76°
F.NO_2.4 / FOV_36°
F.NO_1.8 / FOV_80°
F.NO_1.8 / FOV_81°
F.NO_1.8 / FOV_85°
65M:F.NO_2.0 / FOV_76°
12M(L):F.NO_2.2 / FOV_80°
65M:F.NO_1.8 / FOV_81°
48M:F.NO_2.0 / FOV_80°
24M:F.NO_1.7 / FOV_77° 10M:F.NO_2.4 / FOV_45° 
MCNEX Tilt OIS Technology
MCNEX - Folded Zoom Actuator Leading the future change in the smartphone market
[갤럭시] 또 한 번. 새로운 시대의 시작. | 삼성전자
MCNEX unveils specialized autonomous driving camera technology at CES 2024.
The innovation of future parking! MCNEX valet parking system
A new vision for safety! Thermal cameras
Mcnex's Driver Monitoring System (DMS)
SVM (Surround View Monitoring)SYSTEM