Responding to the Battery Market with BMS Packages and Expanding into Semiconductor Packaging and OSAT Based on Precision Electronic Component Mass Production Experience

With the advancement of automotive electronic systems, the importance of semiconductor packaging is growing. Various automotive electronic systems, such as automotive cameras, sensors, battery management systems, infotainment, cockpits, and clusters, demand higher levels of miniaturization, high integration, reliability, thermal management, and long-term quality stability.

Based on its high-volume mass production experience accumulated in the field of precision electronic components—such as mobile cameras, actuators, biometric modules, and automotive cameras—MCNEX is strengthening its EMS, OEM, and ODM competitiveness focused on semiconductor packaging. In particular, the company is expanding its manufacturing capabilities into automotive semiconductor packages, SiP (System in Package), CLCC (Ceramic Leadless Chip Carrier), BMS Packages, and OSAT.

Through its semiconductor packaging product portfolios including SiP, LGA, QFN, and BGA, as well as its equipment capabilities related to Final Test, reliability testing, and semiconductor back-end processes, MCNEX offers high-reliability semiconductor packaging partnership opportunities to Fabless companies, IDMs, module manufacturers, and automotive component customers. By expanding its precision manufacturing experience into the semiconductor back-end process domain, MCNEX is actively responding to the next-generation automotive electronics and smart device markets.

In the electric vehicle (EV) and energy storage system (ESS) markets, the BMS is a core system that determines battery safety and lifespan management. Through its new industrial and automotive BMS Package business, MCNEX is expanding its manufacturing capabilities into battery management system fields, including BMUs and CMUs.

Based on its precision electronic component manufacturing experience and automotive quality systems, MCNEX can provide highly reliable manufacturing partnerships to EV, ESS, and industrial battery customers.

Expanding Packaging Portfolio: SiP, CLCC, LGA, QFN and BGA

One of the key semiconductor packaging areas pursued by MCNEX is SiP. SiP integrates multiple functional components, such as processors, memory, power devices and oscillators, into a single package. MCNEX presents SiP applications for automotive systems such as AVN, Cluster and Cockpit.

SiP offers advantages in system miniaturization, high-density design, reduced signal interference and low-power operation. As in-vehicle electronic systems become more complex and data processing requirements increase, integrating multiple functions into a single package becomes an important factor in improving design efficiency and product reliability.

MCNEX also has capabilities for various semiconductor packages, including LGA, QFN and BGA. LGA is suitable for thin, lightweight and space-saving products. QFN can be applied to compact packages that require strong thermal and electrical performance. BGA is applicable to products that require high-density I/O and MCP or SiP support.

In addition, MCNEX presents CLCC as a package for automotive CMOS Sensor applications. Automotive CMOS Sensors are core components of camera modules, and this area has direct technical relevance to MCNEX’s established automotive camera mass-production experience.

Establishing OSAT and Back-End Process Capabilities

MCNEX has secured equipment and testing infrastructure for semiconductor packaging and OSAT-related business. Key capabilities include Flip Chip, Ball Mounter, semiconductor cleaning equipment, Final Test facilities, F/T, V/T, SLT lines and reliability testing such as uHAST, TC, HTS, SAT and CT.

These capabilities are essential for semiconductor package development, prototype production, mass-production transition, electrical verification and reliability evaluation. In automotive semiconductor packaging, not only production quality but also reliability verification throughout the product lifecycle is critical. Therefore, back-end process and testing capabilities are important indicators for evaluating a manufacturing partner’s technical readiness.

MCNEX is further strengthening its technical foundation for high-reliability automotive and semiconductor packaging products through Ansys-based simulation tools, ESD management capabilities, IPC Class 3 readiness and Q-100/Q-104 certification experience.

Global Manufacturing Infrastructure Supporting Mass Production and Quality Operations

MCNEX’s global manufacturing infrastructure is a key foundation for expanding its semiconductor packaging-focused EMS, OEM and ODM business. Its manufacturing base in Phuc Son Industrial Park, Ninh Binh, Vietnam, operates on a land area of 150,000㎡, with a building area of 127,338㎡ and 4,572 employees. Major production items include mobile cameras, actuators, biometric modules and automotive cameras.

Its stated monthly production capacity includes 30 million mobile cameras, 11 million actuators, 9 million biometric modules and 1.5 million automotive cameras. This large-scale production base is also significant for semiconductor packaging. In semiconductor packaging, even small process variations can directly affect quality and yield. Therefore, production scale must be supported by process standardization, data management, inspection systems and quality traceability.

MCNEX has established ERP, MES and PLM systems to manage production planning, process execution, quality history and product lifecycle information. This provides a core manufacturing operation framework for responding to customer quality requirements, process change control and mass-production traceability.

In addition, MCNEX has established MCNEX INDIA PRIVATE LIMITED in Sri City, Andhra Pradesh, India, to expand its global automotive electronics business. Based on a 52,892㎡ site, it is planned to be built as a manufacturing and R&D hub for automotive components and systems, with full-scale mass production targeted for the first quarter of 2027.

Quality System Aligned with Automotive Industry Standards

In semiconductor packaging, especially automotive semiconductor packaging, an automotive-grade quality system and customer audit readiness are essential. MCNEX responds to automotive electronics quality requirements through certification and management systems such as IATF 16949, ISO 14001, ISO 45001, ISO/SAE 21434 and ASPICE.

MCNEX also has professional qualification-based capabilities, including VDA 6.3 Process Auditor, iNARTE ESD and IPC Trainer. These capabilities support process audit readiness, electrostatic discharge control and electronic assembly quality management.

For potential customers, this quality system helps reduce mass-production risk. For purchasing managers, it serves as an important criterion for supply chain evaluation. For engineers, it provides a manufacturing foundation for process verification, reliability testing, defect tracking and change management.

Manufacturing Competitiveness Across EMS, OEM and ODM

MCNEX’s EMS, OEM and ODM competitiveness is built on the integration of mass-production experience, semiconductor packaging portfolio, back-end process equipment, reliability testing infrastructure, automotive-grade quality systems, global manufacturing bases and smart factory operations.

From an EMS perspective, MCNEX supports stable mass production and quality management for customer-designed products. From an OEM perspective, the company can establish production systems aligned with customer specifications and quality standards. From an ODM perspective, MCNEX has the foundation to support product structure and process optimization based on its internal technologies in H/W, Mecha, optics, software and autonomous driving algorithms.

The expansion into semiconductor packaging represents an important transition for MCNEX, extending its existing precision electronic component manufacturing capabilities into higher-value automotive electronics and semiconductor back-end processes. MCNEX will continue to strengthen its manufacturing competitiveness to meet global customer requirements in automotive semiconductors, sensors, BMS and next-generation electronic systems.

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